I-SLA (i-Stereolithography) yinkqubo yokuvelisa eyongezelelweyo esebenza ngokugxininisa i-laser ye-UV kwi-vat ye-photopolymer resin.Ngoncedo lwemveliso encediswa yikhompyuter okanye uyilo oluncediswa yikhompyuter (CAM/CAD) isoftwe, i-laser ye-UV isetyenziselwa ukuzoba uyilo olucwangcisiweyo okanye imilo kumphezulu wevat yefotopolymer.Iifotopolymers zinovelwano kukukhanya kwe-ultraviolet, ngoko ke i-resin iqiniswa ngokwefotochemically kwaye yenza umaleko omnye wento efunwayo ye-3D.Le nkqubo iphinda iphindwe kuluhlu ngalunye loyilo kude kube yinto ye-3D epheleleyo.
I-CARMANHAAS inokunika umthengi inkqubo ye-optical ikakhulu ibandakanya i-Galvanometer Scanner ekhawulezayo kunye ne-F-THETA yokuskena i-lens, i-Beam expander, i-Mirror, njl.
Intloko ye-355nm ye-Galvo Scanner
| Umzekelo | PSH14-H | PSH20-H | PSH30-H |
| Amanzi apholileyo/atywinwe intloko yokuskena | Ewe | Ewe | Ewe |
| Umngxuma (mm) | 14 | 20 | 30 |
| Esebenzayo Scan engile | ±10° | ±10° | ±10° |
| Imposiso yokuJonga umkhondo | 0.19 ms | 0.28ms | 0.45ms |
| Ixesha lokuPhendula ngeNyathelo(1% yesikali esipheleleyo) | ≤ 0.4 ms | ≤ 0.6 ms | ≤ 0.9 ms |
| Isantya esiqhelekileyo | |||
| Ukuma / ukutsiba | < 15 m/s | < 12 m/s | < 9 m/s |
| Ukuskena komgca / ukuskena kweraster | < 10 m/s | < 7 m/s | < 4 m/s |
| Ukuskena kwevektha eqhelekileyo | < 4 m/s | < 3 m/s | < 2 m/s |
| Umgangatho wokuBhala oLungileyo | 700 cps | 450 cps | 260 cps |
| Umgangatho wokubhala ophezulu | 550 cps | 320 cps | 180 cps |
| Ukuchaneka | |||
| Umgca | 99.9% | 99.9% | 99.9% |
| Isigqibo | ≤ 1 irad | ≤ 1 irad | ≤ 1 irad |
| Ukuphindaphinda | ≤ 2 irad | ≤ 2 irad | ≤ 2 irad |
| Ubushushu Ukuqhuba | |||
| I-Offset Drift | ≤ 3 urad/℃ | ≤ 3 urad/℃ | ≤ 3 urad/℃ |
| Qver 8hours Ixesha elide Offset Drift (Emva kwe-15min isilumkiso) | ≤ 30 irad | ≤ 30 irad | ≤ 30 irad |
| Uluhlu lobushushu obusebenzayo | 25℃±10℃ | 25℃±10℃ | 25℃±10℃ |
| Ujongano loMqondiso | I-Analog: ± 10V Idijithali: XY2-100 protocol | I-Analog: ± 10V Idijithali: XY2-100 protocol | I-Analog: ± 10V Idijithali: XY2-100 protocol |
| i-Input Power Requirement (DC) | ±15V@ 4A Max RMS | ±15V@ 4A Max RMS | ±15V@ 4A Max RMS |
355nmF-Theta Ilensies
| Icandelo Inkcazo | Ubude bokujongisisa (mm) | Indawo yokuskena (mm) | Ukungena kuMax Umfundi (mm) | Umgama wokuSebenza(mm) | Ukunyuka Umsonto |
| SL-355-360-580 | 580 | 360x360 | 16 | 660 | M85x1 |
| SL-355-520-750 | 750 | 520x520 | 10 | 824.4 | M85x1 |
| SL-355-610-840-(15CA) | 840 | 610x610 | 15 | 910 | M85x1 |
| SL-355-800-1090-(18CA) | 1090 | 800x800 | 18 | 1193 | M85x1 |
I-355nm yeBeam Expander
| Icandelo Inkcazo | Ukwandiswa Umlinganiselo | Igalelo CA (mm) | Imveliso ye-CA (mm) | Izindlu Idayiya(mm) | Izindlu Ubude(mm) | Ukunyuka Umsonto |
| BE3-355-D30:84.5-3x-A(M30 * 1-M43 * 0.5) | 3X | 10 | 33 | 46 | 84.5 | M30 * 1-M43 * 0.5 |
| BE3-355-D33:84.5-5x-A(M30 * 1-M43 * 0.5) | 5X | 10 | 33 | 46 | 84.5 | M30 * 1-M43 * 0.5 |
| BE3-355-D33:80.3-7x-A(M30 * 1-M43 * 0.5) | 7X | 10 | 33 | 46 | 80.3 | M30 * 1-M43 * 0.5 |
| BE3-355-D30:90-8x-A(M30*1-M43*0.5) | 8X | 10 | 33 | 46 | 90.0 | M30 * 1-M43 * 0.5 |
| BE3-355-D30:72-10x-A(M30*1-M43*0.5) | 10X | 10 | 33 | 46 | 72.0 | M30 * 1-M43 * 0.5 |
Isibuko se-355nm
| Icandelo Inkcazo | Ububanzi (mm) | Ukutyeba(mm) | Ukwaleka |
| 355 Isipili | 30 | 3 | HR@355nm,45° AOI |
| 355 Isipili | 20 | 5 | HR@355nm,45° AOI |
| 355 Isipili | 30 | 5 | HR@355nm,45° AOI |
